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| Issue Date | Title | Author(s) |
|---|---|---|
| 2019 | Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses | Lima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, Noé |
| 2020 | Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples | Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé |
| 5-Sep-2019 | Influence of microstructure length scale on the tensile properties and superplasticity of Cu-Doped Sn-34Bi TIM alloy | Silva, Bismarck Luiz; Xavier, Marcella G. C.; Braga, Diogo P.; Sordi, Vitor L.; Spinelli, José Eduardo |
| 2019 | Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate | Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo |
| 11-Jan-2018 | Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy | Silva, Bismarck Luiz; Spinelli, José Eduardo |
| 22-Jun-2018 | Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels | Lima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo |
| 10-Jan-2017 | Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys | Silva, Bismarck Luiz; Silva, Vítor Covre Evangelista da; Garcia, Amauri; Spinelli, José Eduardo |
| 29-Sep-2017 | Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys | Silva, Bismarck Luiz; Xavier, Marcella Gautê Cavalcante; Garcia, Amauri; Spinelli, José Eduardo |
| 15-Jan-2017 | Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys | Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo |
| Apr-2016 | Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys | Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo |
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