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Results 1-10 of 15 (Search time: 0.062 seconds).
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Issue DateTitleAuthor(s)
2020Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couplesLima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé
2019Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rateSilva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo
2019Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responsesLima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, Noé
29-Sep-2017Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloysSilva, Bismarck Luiz; Xavier, Marcella Gautê Cavalcante; Garcia, Amauri; Spinelli, José Eduardo
11-Jan-2018Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloySilva, Bismarck Luiz; Spinelli, José Eduardo
5-Sep-2019Influence of microstructure length scale on the tensile properties and superplasticity of Cu-Doped Sn-34Bi TIM alloySilva, Bismarck Luiz; Xavier, Marcella G. C.; Braga, Diogo P.; Sordi, Vitor L.; Spinelli, José Eduardo
15-Jan-2017Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloysSilva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo
10-Jan-2017Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloysSilva, Bismarck Luiz; Silva, Vítor Covre Evangelista da; Garcia, Amauri; Spinelli, José Eduardo
22-Jun-2018Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levelsLima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo
Apr-2016Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloysSilva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo