Página de Busca
Adicionar filtros:
Utilizar filtros para refinar o resultado de busca.
Conjunto de itens:
Data do documento | Título | Autor(es) |
---|---|---|
2019 | Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses | Lima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, Noé |
Abr-2015 | Synthesis and properties of CuO-doped Ce0.9Gd0.1O2 δ electrolytes for SOFCs | Lima, Chrystian G.M.; Santos, Thamyscira H.; Grilo, João Paulo de Freitas; Dutra, Ricardo P.S.; Nascimento, Rubens Maribondo do; Rajesh, Surendran; Fonseca, Fábio C.; Macedo, Daniel Araújo de |
13-Ago-2015 | Mechanical strength and wear of dental glass-ionomer and resin composites affected by porosity and chemical composition | Rodrigues, Daniela S.; Buciumeanu, Mihaela; Martinelli, Antonio Eduardo; Nascimento, Rubens Maribondo do; Henriques, Bruno; Silva, Filipe Samuel; Souza, Júlio César Matias de |
5-Set-2019 | Influence of microstructure length scale on the tensile properties and superplasticity of Cu-Doped Sn-34Bi TIM alloy | Silva, Bismarck Luiz; Xavier, Marcella G. C.; Braga, Diogo P.; Sordi, Vitor L.; Spinelli, José Eduardo |
12-Abr-2018 | Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni Alloys | Cruz, Clarissa Barros da; Kakitani, Rafael; Xavier, Marcella Gautê Cavalcante; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo |
13-Mar-2018 | High cooling rate, regular and plate like cells in Sn–Ni solder alloys | Xavier, Marcella G. C.; Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo |
31-Dez-2011 | Effect of a zirconia interlayer on the morphological properties of LaSrMnO3- 4YSZ composite films obtained by spin coating | Macedo, Daniel Araújo de; Souza, Graziele L.; Cesário, Moises Rômolos; Cela, Beatriz; Martinelli, Antonio Eduardo; Paskocimas, Carlos Alberto; Nascimento, Rubens Maribondo do |
12-Out-2017 | Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys | Dias, Marcelino; Costa, Thiago A.; Soares, Thiago; Silva, Bismarck Luiz; Cheung, Noé; Spinelli, José Eduardo; Garcia, Amauri |
11-Jan-2018 | Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy | Silva, Bismarck Luiz; Spinelli, José Eduardo |
22-Jun-2018 | Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels | Lima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo |
Busca facetada
Assunto