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| Data do documento | Título | Autor(es) |
|---|---|---|
| 2020 | Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples | Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé |
| 2019 | Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate | Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo |
| 25-Ago-2016 | An alternative thermal approach to evaluate the wettability of solder alloys | Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri |
| Dez-2019 | The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates | Curtulo, Joanisa P.; Dias, Marcelino; Bertelli, Felipe; Silva, Bismarck Luiz; Spinelli, José Eduardo; Garcia, Amauri; Cheung, Noé |
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