Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi

Silva, Bismarck LuizGarcia, AmauriSpinelli, José Eduardo2021-03-152021-03-152016-04SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys. Materials Characterization, [S.L.], v. 114, p. 30-42, abr. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580316300274?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.matchar.2016.02.0021044-5803https://repositorio.ufrn.br/handle/123456789/31884Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn–Bi–Cu alloysSn–Bi–Ag alloysSolder alloysSolidificationCooling rateMicrostructureCooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloysarticle10.1016/j.matchar.2016.02.002