Silva, Bismarck LuizSilva, Pedro Henrique Maciel da2019-10-022021-09-292019-10-022021-09-292019-09-19SILVA, Pedro Henrique Maciel da. Avaliação do Tratamento Térmico de Envelhecimento na Liga Sn-0,7%Cu-0,05%Ni. 2019. 44f. Trabalho de Conclusão de Curso (Graduação em Engenharia de Materiais) - Centro de Tecnologia, Departamento de Engenharia de Materiais, Universidade Federal do Rio Grande do Norte, Natal, 2019.https://repositorio.ufrn.br/handle/123456789/40354Investigations about the effect of thermal cycles (variations of time and temperature) on the microstructures of Pb-free solder alloys are scarce in the literature. Thus, this work aims to perform a microstructural analysis of the influence of aging treatment (T=100°C and times of 10, 20 and 30 days) on the microstructure of directionally solidified Sn-0.7wt%Cu-0.05wt%Ni solder alloy under steady-state conditions against copper substrate. Three different levels of cooling rate (Ṫ) and growth rate (V) were considered for this study, considering the morphology, distribution and size of the phases in the cellular and eutectic regions. The results showed that a cellular array composed of a β-Sn matrix surrounded by eutectic mixture Sn+(Cu,Ni)6Sn5 intermetallics prevailed along the casting length. In initial positions of the alloy casting (up to 8mm), it can be seen dendritic morphology. Refined microstructures have been founded for higher values of V and Ṫ. The (Cu,Ni)6Sn5 intermetallic showed fiber morphology. It can be seen that aging treatment cause lightly increase in the cellular (λC) and eutectic arrangements (λ(Cu,Ni)6Sn5).Attribution-NonCommercial-NoDerivs 3.0 Brazilhttp://creativecommons.org/licenses/by-nc-nd/3.0/br/Solidificação; Liga Sn-0,7%Cu-0,05%Ni; Tratamento térmico de envelhecimento; microestrutura.Solidification, Sn-Cu-Ni alloys, aging treatment; microstructure.bachelorThesis