Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys

Dias, MarcelinoCosta, Thiago A.Soares, ThiagoSilva, Bismarck LuizCheung, NoéSpinelli, José EduardoGarcia, Amauri2021-03-082021-03-082017-10-12DIAS, Marcelino; COSTA, Thiago A.; SOARES, Thiago; SILVA, Bismarck L.; CHEUNG, Noé; SPINELLI, José E.; GARCIA, Amauri. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. Journal of Electronic Materials, [S.L.], v. 47, n. 2, p. 1647-1657, 12 out. 2017. Disponível em: https://link.springer.com/article/10.1007%2Fs11664-017-5837-6. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1007/s11664-017-5837-60361-52351543-186Xhttps://repositorio.ufrn.br/handle/123456789/31738Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn-Sb-X alloysSoldersDirectional solidificationMicrostructureWettabilityTensile propertiesTailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloysarticle10.1007/s11664-017-5837-6