Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels

Lima, Thiago SoaresSilva, Bismarck LuizGarcia, AmauriCheung, NoéSpinelli, José Eduardo2021-03-102021-03-102018-06-22LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/14644207187843141464-42072041-3076https://repositorio.ufrn.br/handle/123456789/31788Attribution-NonCommercial 3.0 Brazilhttp://creativecommons.org/licenses/by-nc/3.0/br/Sn–Cu–Al alloysSoldersSolidificationMicrostructureIntermetallicsEutecticDendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levelsarticle10.1177/1464420718784314