Lima, Thiago SoaresGouveia, Guilherme Lisboa deSeptimio, Rudimylla da SilvaCruz, Clarissa Barros daSilva, Bismarck LuizBrito, CrystopherSpinelli, José EduardoCheung, Noé2021-03-042021-03-042019LIMA, Thiago; GOUVEIA, Guilherme de; SEPTIMIO, Rudimylla da Silva; CRUZ, Clarissa da; SILVA, Bismarck; BRITO, Crystopher; SPINELLI, José; CHEUNG, Noé. Sn-0.5Cu(-x)Al Solder Alloys: microstructure-related aspects and tensile properties responses. Metals, [S.L.], v. 9, n. 2, p. 241-241, 17 fev. 2019. MDPI AG. Disponível em: https://www.mdpi.com/2075-4701/9/2/241. Acesso em: 22 jan. 2021. http://dx.doi.org/10.3390/met9020241.2075-4701https://repositorio.ufrn.br/handle/123456789/31680Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn–Cu–Al alloysSolidificationMicrostructureTensile strengtharticle10.3390/met9020241