Santos, Washington Luis ReisSilva, Bismarck LuizBertelli, FelipeSpinelli, José EduardoCheung, NoéGarcia, Amauri2021-03-152021-03-152016-08-25SANTOS, Washington L.R.; SILVA, Bismarck L.; BERTELLI, Felipe; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. An alternative thermal approach to evaluate the wettability of solder alloys. Applied Thermal Engineering, [S.L.], v. 107, p. 431-440, ago. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1359431116310912?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.applthermaleng.2016.06.1771359-4311https://repositorio.ufrn.br/handle/123456789/31887Zn-Sn solder alloysSolidificationWettabilityInterfacial heat transfer coefficientarticle10.1016/j.applthermaleng.2016.06.177