Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys

Silva, Bismarck LuizSilva, Vítor Covre Evangelista daGarcia, AmauriSpinelli, José Eduardo2021-03-122021-03-122017-01-10Bismarck, L.S.; SILVA, V. C. E.; Garcia, A. ; SPINELLI, J. E.. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017. Disponivel: https://link.springer.com/article/10.1007%2Fs11664-016-5225-7 Acesso em: 26 jan. 2021. https://doi.org/10.1007/s11664-016-5225-70361-52351543-186Xhttps://repositorio.ufrn.br/handle/123456789/31836Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn-Bi alloysSolidificationMicrostructureBi precipitatesTensile strengthFracture surfaceEffects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloysarticle10.1007/s11664-016-5225-7