Estimation of the minimum material removal thickness during the polishing process of ceramic tiles by laser triangulation

Sousa, Fábio José PinheiroSoares Filho, José ElsonAurich, Jan C.Nascimento, Rubens Maribondo doPaskocimas, Carlos Alberto2020-08-172020-08-172018-04-01SOARES FILHO, J.E.; AURICH, J.C.; SOUSA, F.J.P.; NASCIMENTO, R.M.; PASKOCIMAS, C.A.. Estimation of the minimum material removal thickness during the polishing process of ceramic tiles by laser triangulation. Ceramics International, [s.l.], v. 44, n. 5, p. 4646-4652, abr. 2018. Disponível em: https://www.sciencedirect.com/science/article/pii/S027288421732727X?via%3Dihub. Acesso em: 28 jul. 2020. http://dx.doi.org/10.1016/j.ceramint.2017.12.032.0272-8842https://repositorio.ufrn.br/jspui/handle/123456789/298323D micro-inspectionLaser triangulationPorcelain stoneware tileEstimation of the minimum material removal thickness during the polishing process of ceramic tiles by laser triangulationarticle10.1016/j.ceramint.2017.12.032