Lima, Thiago SoaresCruz, Clarissa Barros daSilva, Bismarck LuizBrito, CrystopherGarcia, AmauriSpinelli, José EduardoCheung, Noé2021-03-042021-03-042020SOARES, Thiago; CRUZ, Clarissa; SILVA, Bismarck; BRITO, Crystopher; GARCIA, Amauri; SPINELLI, José Eduardo; CHEUNG, Noé. Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples. Journal Of Electronic Materials, [S.L.], v. 49, n. 1, p. 173-187, 31 jul. 2019. Disponível em: https://link.springer.com/article/10.1007/s11664-019-07454-6. Acesso em: 22 jan. 2021. http://dx.doi.org/10.1007/s11664-019-07454-6.0361-52351543-186Xhttps://repositorio.ufrn.br/handle/123456789/31678Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn-Cu alloySoldersReaction layerHeat transferWettabilitySolidificationInterplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couplesarticle10.1007/s11664-019-07454-6