The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Curtulo, Joanisa P.Dias, MarcelinoBertelli, FelipeSilva, Bismarck LuizSpinelli, José EduardoGarcia, AmauriCheung, Noé2021-04-122019-12CURTULO, Joanisa P.; DIAS, Marcelino; BERTELLI, Felipe; SILVA, Bismarck L.; SPINELLI, José E.; GARCIA, Amauri; CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates. Journal of Manufacturing Processes, [S.L.], v. 48, p. 164-173, dez. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1526612519303706?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jmapro.2019.10.0291526-6125https://repositorio.ufrn.br/handle/123456789/32177Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn-Sb alloyPeritecticHeat transferAnalytical modelSolidificationWettabilityInterfaceThe application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substratesarticle10.1016/j.jmapro.2019.10.029