Silva, Bismarck LuizBertelli, FelipeCanté, Manuel VenceslauSpinelli, José EduardoCheung, NoéGarcia, Amauri2021-03-152021-03-152015-10-31SILVA, Bismarck Luiz; BERTELLI, Felipe; CANTÉ, Manuel V.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys. Journal Of Materials Science: Materials in Electronics, [S.L.], v. 27, n. 2, p. 1994-2003, 31 out. 2015. Disponível em: https://link.springer.com/article/10.1007%2Fs10854-015-3983-2. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1007/s10854-015-3983-20957-45221573-482Xhttps://repositorio.ufrn.br/handle/123456789/31883Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Contact AngleHeat Transfer CoefficientSolder AlloyDirectionally SolidifyVolumetric Expansionarticle10.1007/s10854-015-3983-2