Silva, Bismarck LuizSpinelli, José Eduardo2021-03-082021-03-082018-01-11SILVA, Bismarck Luiz; SPINELLI, José Eduardo. Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy. Materials Research, [S.L.], v. 21, n. 2, p. 1-9, 11 jan. 2018. Disponível em: http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000202109&lng=en&tlng=en. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1590/1980-5373-mr-2017-0877.1516-14391980-5373https://repositorio.ufrn.br/handle/123456789/31739Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Sn-Zn-CuSolidificationMicrostructureCorrelations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloyarticle10.1590/1980-5373-mr-2017-0877