Silva, Bismarck LuizXavier, Marcella Gautê CavalcanteGarcia, AmauriSpinelli, José Eduardo2021-03-122021-03-122017-09-29SILVA, Bismarck L.; XAVIER, Marcella G.C.; GARCIA, Amauri; SPINELLI, José E.. Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys. Materials Science and Engineering: A, [S.L.], v. 705, p. 325-334, set. 2017. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0921509317310754?via%3Dihub. Acesso em: 26 jan. 2021. http://dx.doi.org/10.1016/j.msea.2017.08.0590921-5093https://repositorio.ufrn.br/handle/123456789/31850Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Solder alloysSn-Bi-Cu alloysSn-Bi-Ag alloysSolidificationMicrostructureTensile propertiesCu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloysarticle10.1016/j.msea.2017.08.059