A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Dias, MarcelinoCosta, Thiago AntônioSilva, Bismarck LuizSpinelli, José EduardoCheunga, NoéGarcia, Amauri2021-04-122021-04-122018-02DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.0290026-2714https://repositorio.ufrn.br/handle/123456789/32178Attribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/Solder alloysSn-Sb alloysMicrostructureTensile propertiesWettabilityA comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloysarticle10.1016/j.microrel.2017.12.029