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Issue DateTitleAuthor(s)
13-Aug-2015Mechanical strength and wear of dental glass-ionomer and resin composites affected by porosity and chemical compositionRodrigues, Daniela S.; Buciumeanu, Mihaela; Martinelli, Antonio Eduardo; Nascimento, Rubens Maribondo do; Henriques, Bruno; Silva, Filipe Samuel; Souza, Júlio César Matias de
2013Citrate–hydrothermal synthesis, structure and electrochemical performance of La0.6Sr0.4Co0.2Fe0.8O3−δ cathodes for IT-SOFCsGarcia, Laurênia Martins Pereira; Macedo, Daniel Araújo de; Souza, Graziele L.; Motta, Fabiana Villela da; Paskocimas, Carlos Alberto; Nascimento, Rubens Maribondo do
15-Mar-2021Cerium molybdate nanocrystals: Microstructural, optical and gas- sensing propertiesOliveira, Fernanda Karine Fonseca; Santiago, Anderson de Azevedo Gomes; Catto, Anderson de Azevedo Gomes; Silva, Luís Fernando da; Tranquilin, Ricardo Luis; Silva, Elson Longo da; Motta, Fabiana Villela da; Delmonte, Maurício Roberto Bomio
Dec-1999Brazing Al2O3 to sintered Fe-Ni-Co alloysNascimento, Rubens Maribondo do; Martinelli, Antonio Eduardo; Bushinelli, Augusto José de Almeida; Klein, A. N.
15-Jan-2017Assessing microstructures and mechanical resistances of as-atomized and as-extruded samples of Al-1wt%Fe-1wt%Ni alloyDessi, João Guilherme; Gomes, Leonardo Fernandes; Peres, Maurício Mirdhaui; Canté, Manuel Venceslau; Spinelli, José Eduardo; Silva, Bismarck Luiz
12-Oct-2017Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloysDias, Marcelino; Costa, Thiago A.; Soares, Thiago; Silva, Bismarck Luiz; Cheung, Noé; Spinelli, José Eduardo; Garcia, Amauri
11-Jan-2018Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloySilva, Bismarck Luiz; Spinelli, José Eduardo
22-Jun-2018Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levelsLima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo
Apr-2016Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloysSilva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo
2019Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responsesLima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, Noé