Please use this identifier to cite or link to this item: https://repositorio.ufrn.br/handle/123456789/31542
Title: Neutron diffraction and finite-element analysis of thermal residual stresses on diffusion-bonded silicon carbide–molybdenum joints
Authors: Martinelli, Antonio Eduardo
Drew, Robin A.L.
Fancello, Eduardo A
Rogue, Ronald
Root, John H.
Keywords: Mathematical model;Ceramic–metal
Issue Date: 1999
Publisher: Wiley
Citation: MARTINELLI, A. E.; DREW, R. A. L.; FANCELLO, E.; ROGGE, R. ; ROOT, J.. Neutron diffraction and finite-element analysis of thermal residual stresses on diffusion-bonded silicon carbide-molybdenum joints. Journal of the American Ceramic Society, Estados Unidos da América, v. 82, n.7, p. 1787-1792, 1999. Disponível em: https://ceramics.onlinelibrary.wiley.com/doi/10.1111/j.1151-2916.1999.tb02000.x. Acesso em: 15 jan. 2021. https://doi.org/10.1111/j.1151-2916.1999.tb02000.x
Portuguese Abstract: Various approaches can be used to minimize residual stresses in ceramic–metal joining, such as a refractorymetal interlayer in a hot-pressed joint. Nonetheless, it is still necessary to characterize the stresses at and near the interface between the interlayer and the ceramic, as a function of the hot-pressing parameters. This study combines two techniques to assess the stress distribution of hotpressed silicon carbide–olybdenum joints: neutron diffraction and finite-element (FEM) analysis. The results demonstrate that the joining temperature greatly influences the final stress distribution, and that significant stress accommodation is achieved by controlling the cooling rate of the diffusion couples. FEM analysis provides a broad view of stress distribution profiles, whereas experimental stress values that are obtained via neutron diffraction allow a better assessment of the effects of parameters that are not easily reproduced using a mathematical model
URI: https://repositorio.ufrn.br/handle/123456789/31542
ISSN: 0002-7820
1551-2916
Appears in Collections:CT - DEMAT - Artigos publicados em periódicos

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