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Title: High cooling rate, regular and plate like cells in Sn–Ni solder alloys
Authors: Xavier, Marcella G. C.
Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
Keywords: Microstructure;Sn–Ni;Tensile properties
Issue Date: 13-Mar-2018
Publisher: Wiley
Citation: XAVIER, Marcella G. C.; SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. Advanced Engineering Materials, [S.L.], v. 20, n. 7, p. 1701179-1701179, 13 mar. 2018. Disponível em: Acesso em: 25 jan. 2021.
Portuguese Abstract: Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β‐Sn cells are associated with cooling rates >5.5 and >2.7 K s−1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0002–Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn4 eutectic phase results in higher ductility
ISSN: 1438-1656
Appears in Collections:CT - DEMAT - Artigos publicados em periódicos

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