High cooling rate, regular and plate like cells in Sn–Ni solder alloys
| Author | Xavier, Marcella G. C.; Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo | |
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| Publisher | Wiley | |
| Date | 2018-03-13 | |
| Keywords | Microstructure Sn–Ni Tensile properties | |
| Citation | ||
| Abstract | Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β‐Sn cells are associated with cooling rates >5.5 and >2.7 K s−1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0002–Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn4 eutectic phase results in higher ductility | |
| URI | https://repositorio.ufrn.br/handle/123456789/31787 | |
| Collections | CT - DEMAT - Artigos publicados em periódicos |
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