Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Autores		Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo
Editor		Elsevier
Data		2016-04
Palavras-chave		Sn–Bi–Cu alloys Sn–Bi–Ag alloys Solder alloys Solidification Cooling rate Microstructure
Citação		SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys. Materials Characterization, [S.L.], v. 114, p. 30-42, abr. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580316300274?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.matchar.2016.02.002
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31884