Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys

Autores		Dias, Marcelino; Costa, Thiago A.; Soares, Thiago; Silva, Bismarck Luiz; Cheung, Noé; Spinelli, José Eduardo; Garcia, Amauri
Editor		Springer
Data		2017-10-12
Palavras-chave		Sn-Sb-X alloys Solders Directional solidification Microstructure Wettability Tensile properties
Citação		DIAS, Marcelino; COSTA, Thiago A.; SOARES, Thiago; SILVA, Bismarck L.; CHEUNG, Noé; SPINELLI, José E.; GARCIA, Amauri. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. Journal of Electronic Materials, [S.L.], v. 47, n. 2, p. 1647-1657, 12 out. 2017. Disponível em: https://link.springer.com/article/10.1007%2Fs11664-017-5837-6. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1007/s11664-017-5837-6
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31738