Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses

Lima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, Noé

Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses

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dc.contributor.author	Lima, Thiago Soares
dc.contributor.author	Gouveia, Guilherme Lisboa de
dc.contributor.author	Septimio, Rudimylla da Silva
dc.contributor.author	Cruz, Clarissa Barros da
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Brito, Crystopher
dc.contributor.author	Spinelli, José Eduardo
dc.contributor.author	Cheung, Noé
dc.date.accessioned	2021-03-04T15:12:05Z
dc.date.available	2021-03-04T15:12:05Z
dc.date.issued	2019
dc.description.resumo	In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ1, and secondary, λ2, dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys. View Full-Text	pt_BR
dc.identifier.citation	LIMA, Thiago; GOUVEIA, Guilherme de; SEPTIMIO, Rudimylla da Silva; CRUZ, Clarissa da; SILVA, Bismarck; BRITO, Crystopher; SPINELLI, José; CHEUNG, Noé. Sn-0.5Cu(-x)Al Solder Alloys: microstructure-related aspects and tensile properties responses. Metals, [S.L.], v. 9, n. 2, p. 241-241, 17 fev. 2019. MDPI AG. Disponível em: https://www.mdpi.com/2075-4701/9/2/241. Acesso em: 22 jan. 2021. http://dx.doi.org/10.3390/met9020241.	pt_BR
dc.identifier.doi	10.3390/met9020241
dc.identifier.issn	2075-4701
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31680
dc.language	en	pt_BR
dc.publisher	MDPI	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Sn–Cu–Al alloys	pt_BR
dc.subject	Solidification	pt_BR
dc.subject	Microstructure	pt_BR
dc.subject	Tensile strength	pt_BR
dc.title	Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses	pt_BR
dc.type	article	pt_BR