Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Paixão, Jeverton Laureano; Gomes, Leonardo Fernandes; Reyes, Rodrigo Valenzuela; Garcia, Amauri; Spinelli, José Eduardo; Silva, Bismarck Luiz

Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

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dc.contributor.author	Paixão, Jeverton Laureano
dc.contributor.author	Gomes, Leonardo Fernandes
dc.contributor.author	Reyes, Rodrigo Valenzuela
dc.contributor.author	Garcia, Amauri
dc.contributor.author	Spinelli, José Eduardo
dc.contributor.author	Silva, Bismarck Luiz
dc.date.accessioned	2021-04-12T20:37:53Z
dc.date.issued	2020-08
dc.description.embargo	2022-09
dc.description.resumo	Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic devices. In this framework, the effects of Antimony (Sb) additions on the microstructure and tensile properties of the Sn-52 wt% Bi alloy are investigated. Various Sn-Bi(-Sb) samples solidified at different cooling rates and two levels of Sb-containing alloys allow a comprehensive examination of length scales of either dendritic or eutectic microstructures. A number of experimental techniques are used here to permit a sound analyses of the ternary Sn-Bi(-Sb) alloys: transient directional solidification, optical microscopy (OM), triangle and intercept quantification methods, scanning electron microscopy (SEM), x-ray fluorescence (XRF), x-ray diffraction (XRD), tensile tests and fractography. The addition of Sb enhances the nucleation of primary dendritic trunks, which resulted in a decrease in the primary dendritic arm spacing (λ1) by about 5 times for the Sn-52 wt% Bi-2 wt% Sb alloy as compared to the results for the binary Sn-Bi alloy. The relationships found for tensile properties as a function of the secondary dendritic arm spacing (λ2) demonstrate that Sb additions increase the alloy strength while preserving the ductility. This is due to very thin SnSb intermetallic particles formed in the Sn-rich dendritic matrix. The influence of λ2 variation on both the yield and ultimate strengths is roughly insignificant while the ductility varies strongly between 14.4% and 52% for samples solidified from 0.05 °C/s to 5.0 °C/s respectively. When 2.0 wt% Sb is added, there is a maintenance in the levels of ductility as those found for the binary Sn-Bi alloy. This occurs especially for very refined dendritic and eutectic microstructures samples, which also exhibit a ductile fracture mode	pt_BR
dc.identifier.citation	PAIXÃO, Jeverton Laureano; GOMES, Leonardo Fernandes; REYES, Rodrigo Valenzuela; GARCIA, Amauri; SPINELLI, José Eduardo; SILVA, Bismarck Luiz. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. Materials Characterization, [S.L.], v. 166, p. 110445-110445, ago. 2020. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580320319161?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.matchar.2020.110445	pt_BR
dc.identifier.doi	10.1016/j.matchar.2020.110445
dc.identifier.issn	1044-5803
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/32175
dc.language	en	pt_BR
dc.publisher	Elsevier	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Sn-Bi-Sb alloys	pt_BR
dc.subject	Thermal interface materials	pt_BR
dc.subject	Solidification	pt_BR
dc.subject	Microstructure	pt_BR
dc.subject	Tensile properties	pt_BR
dc.subject	Fracture surface	pt_BR
dc.title	Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys	pt_BR
dc.type	article	pt_BR