Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni Alloys

Cruz, Clarissa Barros da; Kakitani, Rafael; Xavier, Marcella Gautê Cavalcante; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo

Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni Alloys

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dc.contributor.author	Cruz, Clarissa Barros da
dc.contributor.author	Kakitani, Rafael
dc.contributor.author	Xavier, Marcella Gautê Cavalcante
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Garcia, Amauri
dc.contributor.author	Cheung, Noé
dc.contributor.author	Spinelli, José Eduardo
dc.date.accessioned	2021-03-08T17:49:28Z
dc.date.available	2021-03-08T17:49:28Z
dc.date.issued	2018-04-12
dc.description.resumo	The present research work examines the microstructural arrangements formed during the transient solidification of eutectic Sn-0.2wt.%Ni and hypereutectic Sn-0.5wt.%Ni alloys. Also, it examines their respective correlations with solidification thermal parameters: eutectic growth rate (VE) and eutectic cooling rate (ṪE); length scales of matrix and eutectic phases: microstructural spacings and the corresponding tensile properties: ductility and strength. Both alloys were directionally solidified upwards under unsteady-state regime, and characterized by optical and scanning electron microscopy. Concerning the hypereutectic Sn-0.5wt.%Ni, the increase in Ni content is shown to influence both thermal behavior and cellular spacing (λC). The NiSn4 intermetallics is present in the eutectic mixture of both alloys, whilst in the Sn-0.5wt.%Ni alloy the primary phase has been identified by SEM-EDS as the Ni3Sn4 intermetallics. A β-Sn morphological cellular/dendritic transition occurs in the 0.2wt.%Ni eutectic alloy for ṪE> 1.2K/s. Despite that, regular cells in the hypereutectic alloy (0.5wt.%Ni) turns into plate-like cells for ṪE> 1.4K/s. If considered a reference cellular spacing about 20μm (i.e.,λ(c-1/2=0.22), the samples associated with the Sn-0.5wt.%Ni alloy are shown to be associated with higher tensile strengths, but much lower ductility as compared with the corresponding results of the eutectic alloy	pt_BR
dc.identifier.citation	CRUZ, Clarissa Barros da; KAKITANI, Rafael; XAVIERB, Marcella Gautê Cavalcante; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. Materials Research, [S.L.], v. 21, n. 1, p. 1-11, 2018. Disponível em: http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000721106&tlng=en. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1590/1980-5373-mr-2017-1099	pt_BR
dc.identifier.doi	10.1590/1980-5373-mr-2017-1099
dc.identifier.issn	1516-1439
dc.identifier.issn	1980-5373
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31742
dc.language	en	pt_BR
dc.publisher	ABM, ABC, ABPol	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Lead-free alloys	pt_BR
dc.subject	Transient solidification	pt_BR
dc.subject	Microstructure	pt_BR
dc.subject	Intermetallics	pt_BR
dc.subject	Tensile properties	pt_BR
dc.subject	Wettability	pt_BR
dc.title	Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni Alloys	pt_BR
dc.type	article	pt_BR