Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys

dc.contributor.authorSilva, Bismarck Luiz
dc.contributor.authorGarcia, Amauri
dc.contributor.authorSpinelli, José Eduardo
dc.date.accessioned2021-03-12T21:12:37Z
dc.date.available2021-03-12T21:12:37Z
dc.date.issued2017-01-15
dc.description.resumoSn-34 wt%Bi, Sn-34 wt%Bi-2wt%Ag and Sn-34 wt%Bi-0.7 wt%Cu alloys have been directionally solidified (DS) under a broad range of solidification cooling rates. Microstructures have been characterized with emphasis on both eutectic growth and precipitation of Bi within the β-Sn dendritic matrix. The eutectic growth, for all alloys examined, is shown to be associated with the coexistence of coarse and fine lamellar structures with different length-scale of lamellar spacing (λ). Experimental growth relations of λ vs. the cooling rate have been proposed. The length-scale of the lamellae in the fine eutectic ranges from 0.8 to 2.5 μm while in the coarse eutectic from 1.8 to 4.0 μm. Taking as reference the Sn-Bi alloy, both the spacing between Bi precipitates (λp) and the fine eutectic spacing (λfine) increase with Cu and Ag additions, whereas λcoarse remains roughly unaltered. Both ternary Sn-Bi-Ag and Sn-Bi-Cu alloys are shown to have worse distributions of both lamellae in the fine eutectic and of precipitates within Sn-rich dendrites, which resulted in decrease in hardnesspt_BR
dc.identifier.citationSILVA, Bismarck Luiz; GARCIA, Amauri; SPINELLI, José Eduardo. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal Of Alloys And Compounds, [S.L.], v. 691, p. 600-605, jan. 2017. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838816327372?via%3Dihub. Acesso em: 26 jan. 2021. http://dx.doi.org/10.1016/j.jallcom.2016.09.003pt_BR
dc.identifier.doi10.1016/j.jallcom.2016.09.003
dc.identifier.issn0925-8388
dc.identifier.urihttps://repositorio.ufrn.br/handle/123456789/31851
dc.languageenpt_BR
dc.publisherElsevierpt_BR
dc.rightsAttribution 3.0 Brazil*
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/br/*
dc.subjectSn-Bi-(Ag/Cu) alloyspt_BR
dc.subjectTernary eutecticpt_BR
dc.subjectSolidificationpt_BR
dc.subjectMicrostructurept_BR
dc.subjectEutectic spacingpt_BR
dc.titleComplex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloyspt_BR
dc.typearticlept_BR

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