Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
dc.contributor.author | Silva, Bismarck Luiz | |
dc.contributor.author | Garcia, Amauri | |
dc.contributor.author | Spinelli, José Eduardo | |
dc.date.accessioned | 2021-03-12T21:12:37Z | |
dc.date.available | 2021-03-12T21:12:37Z | |
dc.date.issued | 2017-01-15 | |
dc.description.resumo | Sn-34 wt%Bi, Sn-34 wt%Bi-2wt%Ag and Sn-34 wt%Bi-0.7 wt%Cu alloys have been directionally solidified (DS) under a broad range of solidification cooling rates. Microstructures have been characterized with emphasis on both eutectic growth and precipitation of Bi within the β-Sn dendritic matrix. The eutectic growth, for all alloys examined, is shown to be associated with the coexistence of coarse and fine lamellar structures with different length-scale of lamellar spacing (λ). Experimental growth relations of λ vs. the cooling rate have been proposed. The length-scale of the lamellae in the fine eutectic ranges from 0.8 to 2.5 μm while in the coarse eutectic from 1.8 to 4.0 μm. Taking as reference the Sn-Bi alloy, both the spacing between Bi precipitates (λp) and the fine eutectic spacing (λfine) increase with Cu and Ag additions, whereas λcoarse remains roughly unaltered. Both ternary Sn-Bi-Ag and Sn-Bi-Cu alloys are shown to have worse distributions of both lamellae in the fine eutectic and of precipitates within Sn-rich dendrites, which resulted in decrease in hardness | pt_BR |
dc.identifier.citation | SILVA, Bismarck Luiz; GARCIA, Amauri; SPINELLI, José Eduardo. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal Of Alloys And Compounds, [S.L.], v. 691, p. 600-605, jan. 2017. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838816327372?via%3Dihub. Acesso em: 26 jan. 2021. http://dx.doi.org/10.1016/j.jallcom.2016.09.003 | pt_BR |
dc.identifier.doi | 10.1016/j.jallcom.2016.09.003 | |
dc.identifier.issn | 0925-8388 | |
dc.identifier.uri | https://repositorio.ufrn.br/handle/123456789/31851 | |
dc.language | en | pt_BR |
dc.publisher | Elsevier | pt_BR |
dc.rights | Attribution 3.0 Brazil | * |
dc.rights.uri | http://creativecommons.org/licenses/by/3.0/br/ | * |
dc.subject | Sn-Bi-(Ag/Cu) alloys | pt_BR |
dc.subject | Ternary eutectic | pt_BR |
dc.subject | Solidification | pt_BR |
dc.subject | Microstructure | pt_BR |
dc.subject | Eutectic spacing | pt_BR |
dc.title | Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys | pt_BR |
dc.type | article | pt_BR |
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