Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys

Autores		Silva, Bismarck Luiz; Silva, Vítor Covre Evangelista da; Garcia, Amauri; Spinelli, José Eduardo
Editor		Springer
Data		2017-01-10
Palavras-chave		Sn-Bi alloys Solidification Microstructure Bi precipitates Tensile strength Fracture surface
Citação		Bismarck, L.S.; SILVA, V. C. E.; Garcia, A. ; SPINELLI, J. E.. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017. Disponivel: https://link.springer.com/article/10.1007%2Fs11664-016-5225-7 Acesso em: 26 jan. 2021. https://doi.org/10.1007/s11664-016-5225-7
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31836