Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate

dc.contributor.authorSilva, Bismarck Luiz
dc.contributor.authorGarcia, Amauri
dc.contributor.authorSpinelli, José Eduardo
dc.date.accessioned2021-03-04T15:06:03Z
dc.date.available2021-03-04T15:06:03Z
dc.date.issued2019
dc.description.resumoBased on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are comparedpt_BR
dc.identifier.citationSilva, B.L.; Garcia, A. ; SPINELLI, J. E. . Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. Journal of Materials Research and Technology-JMR&T, v. 8, p. 1581-1586, 2019. Disponível em: https://www.sciencedirect.com/science/article/pii/S2238785418302254?via%3Dihub. Acesso em: 21 jan. 2021. https://doi.org/10.1016/j.jmrt.2018.06.016pt_BR
dc.identifier.doi10.1016/j.jmrt.2018.06.016
dc.identifier.issn2238-7854
dc.identifier.urihttps://repositorio.ufrn.br/handle/123456789/31679
dc.languageenpt_BR
dc.publisherElsevierpt_BR
dc.rightsAttribution 3.0 Brazil*
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/br/*
dc.subjectSolder alloyspt_BR
dc.subjectSolidificationpt_BR
dc.subjectWettabilitypt_BR
dc.subjectThermal analysispt_BR
dc.titleWetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling ratept_BR
dc.typearticlept_BR

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