Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Silva, Bismarck Luiz; Bertelli, Felipe; Canté, Manuel Venceslau; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri

Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

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dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Bertelli, Felipe
dc.contributor.author	Canté, Manuel Venceslau
dc.contributor.author	Spinelli, José Eduardo
dc.contributor.author	Cheung, Noé
dc.contributor.author	Garcia, Amauri
dc.date.accessioned	2021-03-15T20:29:56Z
dc.date.available	2021-03-15T20:29:56Z
dc.date.issued	2015-10-31
dc.description.resumo	Bi–Ag lead-free alloys are considered interesting alternatives to Pb-based traditional solders due to compatible melting point and strength. During soldering, the ability of a liquid alloy to flow or spread over the substrate is crucial for the formation of a metallic bond driven by the physicochemical properties of the liquid solder/solid substrate system. In addition, the wettability is intimately associated with the solder/substrate thermal conductance represented by a heat transfer coefficient, hi. In this work, three Bi–Ag alloys (hypoeutectic—1.5 wt%Ag, eutectic—2.5 wt%Ag and hypereutectic—4.0 wt%Ag) were directionally solidified under upward unsteady state heat flow conditions. Both time-dependent hi profiles and wetting behavior represented by contact angles (θ) were determined for the three alloys examined. The dependence of θ on the alloy Ag content is assessed experimentally. Also, thermal readings collected during directional solidification of the Bi 1.5, 2.5 and 4.0 wt% Ag alloys are used with a view to permitting hi versus time (t) profiles to be computed. It is shown that along a first solidification stage (t < 16 s) the hi values followed the trend experimentally observed by the contact angles for the three alloys examined, while for t > 16 s the volumetric expansion of the Bi-rich phase is shown to have a dominant role inducing a sudden increase in hi. For each alloy a couple of time-dependent hi expressions is needed to represent the entire solidification progress	pt_BR
dc.identifier.citation	SILVA, Bismarck Luiz; BERTELLI, Felipe; CANTÉ, Manuel V.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys. Journal Of Materials Science: Materials in Electronics, [S.L.], v. 27, n. 2, p. 1994-2003, 31 out. 2015. Disponível em: https://link.springer.com/article/10.1007%2Fs10854-015-3983-2. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1007/s10854-015-3983-2	pt_BR
dc.identifier.doi	10.1007/s10854-015-3983-2
dc.identifier.issn	0957-4522
dc.identifier.issn	1573-482X
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31883
dc.language	en	pt_BR
dc.publisher	Springer	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Contact Angle	pt_BR
dc.subject	Heat Transfer Coefficient	pt_BR
dc.subject	Solder Alloy	pt_BR
dc.subject	Directionally Solidify	pt_BR
dc.subject	Volumetric Expansion	pt_BR
dc.title	Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys	pt_BR
dc.type	article	pt_BR