High cooling rate, regular and plate like cells in Sn–Ni solder alloys
| dc.contributor.author | Xavier, Marcella G. C. | |
| dc.contributor.author | Silva, Bismarck Luiz | |
| dc.contributor.author | Garcia, Amauri | |
| dc.contributor.author | Spinelli, José Eduardo | |
| dc.date.accessioned | 2021-03-10T12:07:25Z | |
| dc.date.available | 2021-03-10T12:07:25Z | |
| dc.date.issued | 2018-03-13 | |
| dc.description.resumo | Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β‐Sn cells are associated with cooling rates >5.5 and >2.7 K s−1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0002–Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn4 eutectic phase results in higher ductility | pt_BR |
| dc.identifier.citation | XAVIER, Marcella G. C.; SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. Advanced Engineering Materials, [S.L.], v. 20, n. 7, p. 1701179-1701179, 13 mar. 2018. Disponível em: https://onlinelibrary.wiley.com/doi/abs/10.1002/adem.201701179. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1002/adem.201701179 | pt_BR |
| dc.identifier.doi | 10.1002/adem.201701179 | |
| dc.identifier.issn | 1438-1656 | |
| dc.identifier.issn | 1527-2648 | |
| dc.identifier.uri | https://repositorio.ufrn.br/handle/123456789/31787 | |
| dc.language | en | pt_BR |
| dc.publisher | Wiley | pt_BR |
| dc.rights | Attribution 3.0 Brazil | * |
| dc.rights.uri | http://creativecommons.org/licenses/by/3.0/br/ | * |
| dc.subject | Microstructure | pt_BR |
| dc.subject | Sn–Ni | pt_BR |
| dc.subject | Tensile properties | pt_BR |
| dc.title | High cooling rate, regular and plate like cells in Sn–Ni solder alloys | pt_BR |
| dc.type | article | pt_BR |
Arquivos
Licença do Pacote
1 - 1 de 1
Nenhuma Miniatura disponível
- Nome:
- license.txt
- Tamanho:
- 1.45 KB
- Formato:
- Item-specific license agreed upon to submission
Nenhuma Miniatura disponível