Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Silva, Bismarck Luiz; Spinelli, José Eduardo

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

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dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Spinelli, José Eduardo
dc.date.accessioned	2021-03-08T17:46:12Z
dc.date.available	2021-03-08T17:46:12Z
dc.date.issued	2018-01-11
dc.description.resumo	The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ2) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (ṪL) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing	pt_BR
dc.identifier.citation	SILVA, Bismarck Luiz; SPINELLI, José Eduardo. Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy. Materials Research, [S.L.], v. 21, n. 2, p. 1-9, 11 jan. 2018. Disponível em: http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000202109&lng=en&tlng=en. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1590/1980-5373-mr-2017-0877.	pt_BR
dc.identifier.doi	10.1590/1980-5373-mr-2017-0877
dc.identifier.issn	1516-1439
dc.identifier.issn	1980-5373
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31739
dc.language	en	pt_BR
dc.publisher	ABM, ABC, ABPol	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Sn-Zn-Cu	pt_BR
dc.subject	Solidification	pt_BR
dc.subject	Microstructure	pt_BR
dc.title	Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy	pt_BR
dc.type	article	pt_BR