Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

Spinelli, José Eduardo; Macedo, R. A.; Silva, Bismarck Luiz; Garcia, A.

Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy

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dc.contributor.author	Spinelli, José Eduardo
dc.contributor.author	Macedo, R. A.
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Garcia, A.
dc.date.accessioned	2021-03-15T20:47:50Z
dc.date.available	2021-03-15T20:47:50Z
dc.date.issued	2016
dc.description.resumo	In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temperatures. However, a lack of understanding regarding the effects of solidification thermal parameters (growth rate - VL, the cooling rate - dot T) on microstructural aspects is reported in literature. Another challenge is to improve properties and reliability. The results of the present study include the determination of the tip growth rate and the cooling rate by cooling curves recorded by thermocouples positioned along the casting length, metallography, X-ray fluorescence (XRF) and Vickers hardness. The entire directionally solidified Bi-1.5Ag microstructure was arranged by faceted Bi-rich dendrites surrounded by a eutectic mixture (Bi+Ag). The primary and secondary dendrite arm spacing (λ1 and λ2), the interphase spacing (λ) and the diameter of Ag-rich particles were also measured along the casting length; and experimental growth laws. Relating these microstructural features to the experimental thermal parameters are proposed	pt_BR
dc.identifier.citation	SPINELLI, J e; A MACEDO, R; SILVA, B L; A GARCIA,. Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy. Iop Conference Series: Materials Science and Engineering, [S.L.], v. 117, p. 012028-012028, mar. 2016. Disponível em: https://iopscience.iop.org/article/10.1088/1757-899X/117/1/012028. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1088/1757-899x/117/1/012028	pt_BR
dc.identifier.doi	10.1088/1757-899x/117/1/012028
dc.identifier.issn	1757-8981
dc.identifier.issn	1757-899X
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31885
dc.language	en	pt_BR
dc.publisher	IOP Publishing	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Hypoeutectic Bi-1.5wt%Ag	pt_BR
dc.subject	Pb-based	pt_BR
dc.title	Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy	pt_BR
dc.type	article	pt_BR