Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

Autores		Silva, Bismarck Luiz; Xavier, Marcella Gautê Cavalcante; Garcia, Amauri; Spinelli, José Eduardo
Editor		Elsevier
Data		2017-09-29
Palavras-chave		Solder alloys Sn-Bi-Cu alloys Sn-Bi-Ag alloys Solidification Microstructure Tensile properties
Citação		SILVA, Bismarck L.; XAVIER, Marcella G.C.; GARCIA, Amauri; SPINELLI, José E.. Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys. Materials Science and Engineering: A, [S.L.], v. 705, p. 325-334, set. 2017. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0921509317310754?via%3Dihub. Acesso em: 26 jan. 2021. http://dx.doi.org/10.1016/j.msea.2017.08.059
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31850