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search.filters.author.Lima, Thiago Soares
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search.filters.author.Cheung, Noé
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search.filters.author.Silva, Bismarck Luiz
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search.filters.author.Spinelli, José Eduardo
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search.filters.author.Brito, Crystopher
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search.filters.subject.Solidification
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search.filters.subject.Microstructure
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search.filters.subject.Sn–Cu–Al alloys
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search.filters.subject.Solders
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search.filters.subject.Eutectic
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Author: search.filters.author.Lima, Thiago Soares
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Article
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
(
SAGE Publications
,
2018-06-22
)
Lima, Thiago Soares
;
Silva, Bismarck Luiz
;
Garcia, Amauri
;
Cheung, Noé
;
Spinelli, José Eduardo
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Article
Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses
(
MDPI
,
2019
)
Lima, Thiago Soares
;
Gouveia, Guilherme Lisboa de
;
Septimio, Rudimylla da Silva
;
Cruz, Clarissa Barros da
;
Silva, Bismarck Luiz
;
Brito, Crystopher
;
Spinelli, José Eduardo
;
Cheung, Noé
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Article
Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples
(
Springer
,
2020
)
Lima, Thiago Soares
;
Cruz, Clarissa Barros da
;
Silva, Bismarck Luiz
;
Brito, Crystopher
;
Garcia, Amauri
;
Spinelli, José Eduardo
;
Cheung, Noé
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