Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

Autores		Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé
Editor		Springer
Data		2020
Palavras-chave		Sn-Cu alloy Solders Reaction layer Heat transfer Wettability Solidification
Citação		SOARES, Thiago; CRUZ, Clarissa; SILVA, Bismarck; BRITO, Crystopher; GARCIA, Amauri; SPINELLI, José Eduardo; CHEUNG, Noé. Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples. Journal Of Electronic Materials, [S.L.], v. 49, n. 1, p. 173-187, 31 jul. 2019. Disponível em: https://link.springer.com/article/10.1007/s11664-019-07454-6. Acesso em: 22 jan. 2021. http://dx.doi.org/10.1007/s11664-019-07454-6.
Resumo
URI		https://repositorio.ufrn.br/handle/123456789/31678