Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé

Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples

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dc.contributor.author	Lima, Thiago Soares
dc.contributor.author	Cruz, Clarissa Barros da
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Brito, Crystopher
dc.contributor.author	Garcia, Amauri
dc.contributor.author	Spinelli, José Eduardo
dc.contributor.author	Cheung, Noé
dc.date.accessioned	2021-03-04T14:56:24Z
dc.date.available	2021-03-04T14:56:24Z
dc.date.issued	2020
dc.description.resumo	Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms affecting the heat transfer efficiency between this alloy and substrates of interest. Nickel (Ni) and copper (Cu) were tested since they are considered work piece materials of importance in electronic soldering. Moreover, low carbon steel was tested as a matter of comparison. For each tested case, wetting angles, integrity and nature of the interfaces and transient heat transfer coefficients, ‘h’, were determined. Even though the copper has a thermal conductivity greater than nickel, it is demonstrated that the occurrence of voids at the copper interface during alloy soldering may decrease the heat transfer efficiency, i.e., ‘h’. Oppositely, a more stable and less defective reaction layer was formed for the alloy/nickel couple. This is due to the suppression of the undesirable thermal contraction since the hexagonal Cu6Sn5 intermetallics is stable at temperatures below 186°C in the presence of nickel	pt_BR
dc.identifier.citation	SOARES, Thiago; CRUZ, Clarissa; SILVA, Bismarck; BRITO, Crystopher; GARCIA, Amauri; SPINELLI, José Eduardo; CHEUNG, Noé. Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples. Journal Of Electronic Materials, [S.L.], v. 49, n. 1, p. 173-187, 31 jul. 2019. Disponível em: https://link.springer.com/article/10.1007/s11664-019-07454-6. Acesso em: 22 jan. 2021. http://dx.doi.org/10.1007/s11664-019-07454-6.	pt_BR
dc.identifier.doi	10.1007/s11664-019-07454-6
dc.identifier.issn	0361-5235
dc.identifier.issn	1543-186X
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31678
dc.language	en	pt_BR
dc.publisher	Springer	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Sn-Cu alloy	pt_BR
dc.subject	Solders	pt_BR
dc.subject	Reaction layer	pt_BR
dc.subject	Heat transfer	pt_BR
dc.subject	Wettability	pt_BR
dc.subject	Solidification	pt_BR
dc.title	Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples	pt_BR
dc.type	article	pt_BR