1. Universidade Federal do Rio Grande do Norte
2. Centro de Tecnologia
3. DEMAT - Departamento de Engenharia de Materiais
4. CT - DEMAT - Artigos publicados em periódicos

Título:	Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
Autor(es):	Lima, Thiago Soares Silva, Bismarck Luiz Garcia, Amauri Cheung, Noé Spinelli, José Eduardo
Palavras-chave:	Sn–Cu–Al alloys;Solders;Solidification;Microstructure;Intermetallics;Eutectic
Data do documento:	22-Jun-2018
Editor:	SAGE Publications
Referência:	LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/1464420718784314
Resumo:	The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, λ2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones
URI:	https://repositorio.ufrn.br/handle/123456789/31788
ISSN:	1464-4207 2041-3076
Aparece nas coleções:	CT - DEMAT - Artigos publicados em periódicos

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