Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

dc.contributor.authorSchon, Aline Ferreira
dc.contributor.authorReyes, Rodrigo Valenzuela
dc.contributor.authorSpinelli, José Eduardo
dc.contributor.authorGarcia, Amauri
dc.contributor.authorSilva, Bismarck Luiz
dc.date.accessioned2021-04-12T20:40:33Z
dc.date.issued2019-11-15
dc.description.embargo2021-12
dc.description.resumoIn the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys (containing 85 to 97 wt% of Pb) given that lead (Pb) is considered an important environmental complaint and has devastating effects on the human body. The imposed conditions in the present experiment may lead to solutal and thermal stability of the melt throughout solid growth towards the liquid. It was found that Sn-rich cells may prevail for cooling rates higher than 1.0 K/s whereas only Sn-rich dendrites appear for specimens solidified at rates lower than 0.3 K/s. The growth of dendrites is delayed when compared to previous results in the literature. In the presence of convective flow originated either thermally or solutally, β-Sn dendrites were reported to grow for samples solidified at rates as high as 1.5 K/s (i.e., 5 times higher). It appears that convection currents induce instabilities to happen at the solidification front and the growth of dendrites is benefited over such conditions. Tensile tests were also performed for Sn-Sb samples having distinct cellular and dendritic dimensions. It was found that unstable plastic flow happened during all tensile tests. The formation of bands along a specimen gauge was recognized as being a manifestation of the Portevin – Le Chatelier (PLC) effect. A homogeneous deformation stage preceded the start of serrations of stresses in the samples of the investigated alloy. The amplitudes of the serrations were found to be lower in the samples having cells as compared to those associated with dendritic microstructurespt_BR
dc.identifier.citationSCHON, Aline Ferreira; REYES, Rodrigo Valenzuela; SPINELLI, José Eduardo; GARCIA, Amauri; SILVA, Bismarck Luiz. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal Of Alloys And Compounds, [S.L.], v. 809, p. 151780-151780, nov. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838819330130?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jallcom.2019.151780pt_BR
dc.identifier.doi10.1016/j.jallcom.2019.151780
dc.identifier.issn0925-8388
dc.identifier.urihttps://repositorio.ufrn.br/handle/123456789/32176
dc.languageenpt_BR
dc.publisherElsevierpt_BR
dc.rightsAttribution 3.0 Brazil*
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/br/*
dc.subjectSn-Sb alloypt_BR
dc.subjectSolderspt_BR
dc.subjectSolidificationpt_BR
dc.subjectMicrostructurept_BR
dc.subjectTensile behaviorpt_BR
dc.titleAssessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling ratept_BR
dc.typearticlept_BR

Arquivos

Pacote Original

Agora exibindo 1 - 1 de 1
Carregando...
Imagem de Miniatura
Nome:
AssessingMicrostructure_SILVA_2019.pdf
Tamanho:
3.9 MB
Formato:
Adobe Portable Document Format
Carregando...
Imagem de Miniatura
Baixar

Licença do Pacote

Agora exibindo 1 - 1 de 1
Nenhuma Miniatura disponível
Nome:
license.txt
Tamanho:
1.45 KB
Formato:
Item-specific license agreed upon to submission
Nenhuma Miniatura disponível
Baixar