Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

Autores		Schon, Aline Ferreira; Reyes, Rodrigo Valenzuela; Spinelli, José Eduardo; Garcia, Amauri; Silva, Bismarck Luiz
Editor		Elsevier
Data		2019-11-15
Palavras-chave		Sn-Sb alloy Solders Solidification Microstructure Tensile behavior
Citação		SCHON, Aline Ferreira; REYES, Rodrigo Valenzuela; SPINELLI, José Eduardo; GARCIA, Amauri; SILVA, Bismarck Luiz. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal Of Alloys And Compounds, [S.L.], v. 809, p. 151780-151780, nov. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838819330130?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jallcom.2019.151780
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URI		https://repositorio.ufrn.br/handle/123456789/32176