An alternative thermal approach to evaluate the wettability of solder alloys

Autores		Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri
Editor		Elsevier
Data		2016-08-25
Palavras-chave		Zn-Sn solder alloys Solidification Wettability Interfacial heat transfer coefficient
Citação		SANTOS, Washington L.R.; SILVA, Bismarck L.; BERTELLI, Felipe; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. An alternative thermal approach to evaluate the wettability of solder alloys. Applied Thermal Engineering, [S.L.], v. 107, p. 431-440, ago. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1359431116310912?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.applthermaleng.2016.06.177
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URI		https://repositorio.ufrn.br/handle/123456789/31887

Coleções	CT - DEMAT - Artigos publicados em periódicos

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