An alternative thermal approach to evaluate the wettability of solder alloys
| dc.contributor.author | Santos, Washington Luis Reis | |
| dc.contributor.author | Silva, Bismarck Luiz | |
| dc.contributor.author | Bertelli, Felipe | |
| dc.contributor.author | Spinelli, José Eduardo | |
| dc.contributor.author | Cheung, Noé | |
| dc.contributor.author | Garcia, Amauri | |
| dc.date.accessioned | 2021-03-15T21:09:16Z | |
| dc.date.available | 2021-03-15T21:09:16Z | |
| dc.date.issued | 2016-08-25 | |
| dc.description.resumo | The aim of the work is to propose an alternative method to qualitatively evaluate the wettability of different alloys of a particular alloy system. The technique is based on a thermal approach supported by experimental/theoretical methodologies involving a directional solidification procedure and numerical simulations based on the solution of the inverse heat conduction problem (IHCP). The wettability strongly affects the heat ability to flow across the alloy/substrate interface during solidification, which is construed as a heat transfer coefficient (hg). Particularly, for the alloys used in soldering processes, the wettability plays an important role in the integrity of solder junctions, being a fundamental parameter for selecting the most appropriate solder composition. The experiments were carried out with high temperature Zn-Sn solder alloys (10, 20, 30 and 40 wt%Sn) in a solidification device in which heat is extracted only through a water-cooled steel bottom. Experimental thermal profiles collected during solidification are used as input data to solve the IHCP and determine expressions hg vs. time for each alloy examined, permitting a tendency of wettability to be established. In order to validate the wetting behavior indicated by the hg values, alloy/substrate contact angles (θ) were measured on a steel substrate using a goniometer. It is shown that both hg and θ indicate improvements in wettability with the decrease in the alloy Sn content | pt_BR |
| dc.identifier.citation | SANTOS, Washington L.R.; SILVA, Bismarck L.; BERTELLI, Felipe; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. An alternative thermal approach to evaluate the wettability of solder alloys. Applied Thermal Engineering, [S.L.], v. 107, p. 431-440, ago. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1359431116310912?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.applthermaleng.2016.06.177 | pt_BR |
| dc.identifier.doi | 10.1016/j.applthermaleng.2016.06.177 | |
| dc.identifier.issn | 1359-4311 | |
| dc.identifier.uri | https://repositorio.ufrn.br/handle/123456789/31887 | |
| dc.language | en | pt_BR |
| dc.publisher | Elsevier | pt_BR |
| dc.subject | Zn-Sn solder alloys | pt_BR |
| dc.subject | Solidification | pt_BR |
| dc.subject | Wettability | pt_BR |
| dc.subject | Interfacial heat transfer coefficient | pt_BR |
| dc.title | An alternative thermal approach to evaluate the wettability of solder alloys | pt_BR |
| dc.type | article | pt_BR |
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