Centro de Tecnologia
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Article The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates(Elsevier, 2019-12) Curtulo, Joanisa P.; Dias, Marcelino; Bertelli, Felipe; Silva, Bismarck Luiz; Spinelli, José Eduardo; Garcia, Amauri; Cheung, NoéArticle An alternative thermal approach to evaluate the wettability of solder alloys(Elsevier, 2016-08-25) Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, AmauriArticle Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels(SAGE Publications, 2018-06-22) Lima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José EduardoArticle Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses(MDPI, 2019) Lima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, NoéArticle Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples(Springer, 2020) Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé