Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Xavier, Marcella Gautê Cavalcante; Cruz, Clarissa Barros da; Kakitani, Rafael; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José Eduardo

Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: related effects on the matrix micromorphology, nature of intermetallics and tensile properties

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dc.contributor.author	Xavier, Marcella Gautê Cavalcante
dc.contributor.author	Cruz, Clarissa Barros da
dc.contributor.author	Kakitani, Rafael
dc.contributor.author	Silva, Bismarck Luiz
dc.contributor.author	Garcia, Amauri
dc.contributor.author	Cheung, Noé
dc.contributor.author	Spinelli, José Eduardo
dc.date.accessioned	2021-03-12T20:19:59Z
dc.date.available	2021-03-12T20:19:59Z
dc.date.issued	2017-11-05
dc.description.resumo	The present investigation is focused on, firstly, performing transient directional solidification experiments with a Sn-0.2 wt.% Ni solder alloy using two different substrates as mold sheets separating the alloy casting from the cooling fluid: copper and low carbon steel. Secondly, the examination of the obtained microstructures is carried out highlighting not only the micromorphology aspects of the formed β-Sn phase but also the nature and the shape of the intermetallic compounds (IMCs) developed. The purpose of this research work is to verify the influences that different substrate materials may have on the alloy solidification kinetics, resultant microstructures and tensile properties of the Sn-0.2 wt.%Ni solder. The microstructure characteristics may be correlated with thermal solidification parameters such as the eutectic cooling rate and eutectic growth rate along with a qualitative evaluation of Fe and Cu dissolutions into the alloy. The results display that the dissolution of Cu into the Sn-Ni alloy provided the prevalent growth of the (Cu,Ni)6Sn5 fiber-like eutectic phase along the length of the casting. Other than, the Cu-containing Sn-Ni alloy allowed the growth of high-velocity β-Sn cells only for very high cooling rates, associated with positions closer to the bottom of the alloy casting. Farther positions are characterized by a complex growth of β-Sn dendrites. On the other hand, for the alloy solidified against the steel mold, a predominance of the non-equilibrium NiSn4 eutectic phase with plate-like shape has been identified by SEM/EDS and XRD. In this case, the predominant growth of β-Sn cells associated with the presence of the plates of the NiSn4 IMC allowed lower tensile strength and higher ductility to be attained	pt_BR
dc.identifier.citation	XAVIER, Marcella G.C.; CRUZ, Clarissa B.; KAKITANI, Rafael; SILVA, Bismarck L.; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José E.. Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: related effects on the matrix micromorphology, nature of intermetallics and tensile properties. Journal of Alloys and Compounds, [S.L.], v. 723, p. 1039-1052, nov. 2017. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S092583881732337X?via%3Dihub. Acesso em: 26 Jan. 2021. http://dx.doi.org/10.1016/j.jallcom.2017.06.329	pt_BR
dc.identifier.doi	10.1016/j.jallcom.2017.06.329
dc.identifier.issn	0925-8388
dc.identifier.uri	https://repositorio.ufrn.br/handle/123456789/31849
dc.language	en	pt_BR
dc.publisher	Elsevier	pt_BR
dc.rights	Attribution 3.0 Brazil	*
dc.rights.uri	http://creativecommons.org/licenses/by/3.0/br/	*
dc.subject	Sn-Ni alloys	pt_BR
dc.subject	Solders	pt_BR
dc.subject	Directional solidification	pt_BR
dc.subject	Microstructure	pt_BR
dc.subject	Intermetallics	pt_BR
dc.subject	Tensile properties	pt_BR
dc.title	Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: related effects on the matrix micromorphology, nature of intermetallics and tensile properties	pt_BR
dc.type	article	pt_BR