Centro de Tecnologia
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Article Zn–Al–Cu alloys: exploring the correlations between microstructure, copper content, and wear(Advanced Engineering Materials, 2025) Medeiros, Múcio Dantas de; Costa, Thiago Antônio Paixão de Sousa; Septimio, Rudimylla; Spinelli José Eduardo; Cheung, Noé; Garcia, Amauri; Silva, Bismarck Luiz; https://orcid.org/0000-0003-2863-5780; https://orcid.org/0000-0003-2424-8839; https://orcid.org/0000-0002-5816-8821; https://orcid.org/0000-0003-0611-1038; https://orcid.org/0000-0003-1120-8926; https://orcid.org/0000-0002-3834-3258; https://orcid.org/0000-0001-7191-1942Article Understanding the influence of aging time on the eutectic growth of Sn-xBi solder alloys(Material Research, 2025-06-08) Silva, Bismarck Luis; Dantas, Suylan Lourdes de Araújo; Sobral, Bruno; Garcia, Amauri; Spinelli, José Eduardo; https://orcid.org/0000-0001-7191-1942; https://orcid.org/0000-0003-3306-2358; https://orcid.org/0000-0003-0611-1038; https://orcid.org/0000-0002-3834-3258Article A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys(Elsevier, 2018-02) Dias, Marcelino; Costa, Thiago Antônio; Silva, Bismarck Luiz; Spinelli, José Eduardo; Cheunga, Noé; Garcia, AmauriArticle The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates(Elsevier, 2019-12) Curtulo, Joanisa P.; Dias, Marcelino; Bertelli, Felipe; Silva, Bismarck Luiz; Spinelli, José Eduardo; Garcia, Amauri; Cheung, NoéArticle Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate(Elsevier, 2019-11-15) Schon, Aline Ferreira; Reyes, Rodrigo Valenzuela; Spinelli, José Eduardo; Garcia, Amauri; Silva, Bismarck LuizArticle Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys(Elsevier, 2020-08) Paixão, Jeverton Laureano; Gomes, Leonardo Fernandes; Reyes, Rodrigo Valenzuela; Garcia, Amauri; Spinelli, José Eduardo; Silva, Bismarck LuizArticle The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy(Elsevier, 2020-01-01) Ramos, Lidiane Silva; Reyes, Rodrigo Valenzuela; Gomes, Leonardo Fernandes; Garcia, Amauri; Spinelli, José Eduardo; Silva, Bismarck LuizArticle An alternative thermal approach to evaluate the wettability of solder alloys(Elsevier, 2016-08-25) Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, AmauriArticle Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys(Elsevier, 2016-04) Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José EduardoArticle Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys(Springer, 2015-10-31) Silva, Bismarck Luiz; Bertelli, Felipe; Canté, Manuel Venceslau; Spinelli, José Eduardo; Cheung, Noé; Garcia, Amauri