DEMAT - Departamento de Engenharia de Materiais
Permanent URI for this communityhttps://repositorio.ufrn.br/handle/1/130
Browse
19 results
Search Results
Article Advancing the solidification of Sn–Bi alloys for electronic packaging: challenges, progress, and future directions(MetalMat, 2025-08-18) Silva, Bismarck Luis; Xavier, Marcela Gautê Cavalcante; Spinelli, José Eduardo; https://orcid.org/0000-0001-7191-1942; https://orcid.org/0000-0003-0611-1038; https://orcid.org/0000-0001-5690-9377Article Assessment of the solidification behavior and microhardness of Sb-modified Sn-Ag alloys(Microelectronics Reliability, 2025) Freitas, Pâmella Raffaela Dantas de; Sobral, Bruno Silva; Sousa, Raí Batista de; Paixão, Jeverton Laureano; Carvalho, Zulmara Virginia de; Spinelli, José Eduardo; Silva, Bismarck Luiz; https://orcid.org/0009-0006-0276-2123; https://orcid.org/0000-0001-5722-5081; https://orcid.org/0000-0002-5233-6847; https://orcid.org/0000-0003-3482-2638; https://orcid.org/0000-0003-2923-652X; https://orcid.org/0000-0001-7191-1942Article Unveiling the impact of Cr on the solidification and mechanical properties of heat-resistant Al-13 %Ce alloy(Journal of Alloys and Compounds, 2025) Paula, Anderson Damasceno de; Gouveia, Guilherme Lisboa de; Gonçalves, Vinícius Richieri Manso; Afonso, Conrado Ramos Moreira; Silva, Bismarck Luiz; Spinelli, José Eduardo; https://orcid.org/0009-0007-9338-4566; https://orcid.org/0000-0001-6887-4976; https://orcid.org/0000-0002-3464-9217; https://orcid.org/0000-0001-7505-8467; https://orcid.org/0000-0001-7191-1942; https://orcid.org/0000-0003-0611-1038Article Understanding the influence of aging time on the eutectic growth of Sn-xBi solder alloys(Material Research, 2025-06-08) Silva, Bismarck Luis; Dantas, Suylan Lourdes de Araújo; Sobral, Bruno; Garcia, Amauri; Spinelli, José Eduardo; https://orcid.org/0000-0001-7191-1942; https://orcid.org/0000-0003-3306-2358; https://orcid.org/0000-0003-0611-1038; https://orcid.org/0000-0002-3834-3258Article The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates(Elsevier, 2019-12) Curtulo, Joanisa P.; Dias, Marcelino; Bertelli, Felipe; Silva, Bismarck Luiz; Spinelli, José Eduardo; Garcia, Amauri; Cheung, NoéArticle Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate(Elsevier, 2019-11-15) Schon, Aline Ferreira; Reyes, Rodrigo Valenzuela; Spinelli, José Eduardo; Garcia, Amauri; Silva, Bismarck LuizArticle Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys(Elsevier, 2020-08) Paixão, Jeverton Laureano; Gomes, Leonardo Fernandes; Reyes, Rodrigo Valenzuela; Garcia, Amauri; Spinelli, José Eduardo; Silva, Bismarck LuizArticle The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy(Elsevier, 2020-01-01) Ramos, Lidiane Silva; Reyes, Rodrigo Valenzuela; Gomes, Leonardo Fernandes; Garcia, Amauri; Spinelli, José Eduardo; Silva, Bismarck LuizArticle An alternative thermal approach to evaluate the wettability of solder alloys(Elsevier, 2016-08-25) Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, AmauriArticle Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys(Elsevier, 2016-04) Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo