Centro de Tecnologia
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Article Zn–Al–Cu alloys: exploring the correlations between microstructure, copper content, and wear(Advanced Engineering Materials, 2025) Medeiros, Múcio Dantas de; Costa, Thiago Antônio Paixão de Sousa; Septimio, Rudimylla; Spinelli José Eduardo; Cheung, Noé; Garcia, Amauri; Silva, Bismarck Luiz; https://orcid.org/0000-0003-2863-5780; https://orcid.org/0000-0003-2424-8839; https://orcid.org/0000-0002-5816-8821; https://orcid.org/0000-0003-0611-1038; https://orcid.org/0000-0003-1120-8926; https://orcid.org/0000-0002-3834-3258; https://orcid.org/0000-0001-7191-1942Article The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates(Elsevier, 2019-12) Curtulo, Joanisa P.; Dias, Marcelino; Bertelli, Felipe; Silva, Bismarck Luiz; Spinelli, José Eduardo; Garcia, Amauri; Cheung, NoéArticle An alternative thermal approach to evaluate the wettability of solder alloys(Elsevier, 2016-08-25) Santos, Washington Luis Reis; Silva, Bismarck Luiz; Bertelli, Felipe; Spinelli, José Eduardo; Cheung, Noé; Garcia, AmauriArticle Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys(Springer, 2015-10-31) Silva, Bismarck Luiz; Bertelli, Felipe; Canté, Manuel Venceslau; Spinelli, José Eduardo; Cheung, Noé; Garcia, AmauriArticle Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: related effects on the matrix micromorphology, nature of intermetallics and tensile properties(Elsevier, 2017-11-05) Xavier, Marcella Gautê Cavalcante; Cruz, Clarissa Barros da; Kakitani, Rafael; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José EduardoArticle Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels(SAGE Publications, 2018-06-22) Lima, Thiago Soares; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José EduardoArticle Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni Alloys(ABM, ABC, ABPol, 2018-04-12) Cruz, Clarissa Barros da; Kakitani, Rafael; Xavier, Marcella Gautê Cavalcante; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José EduardoArticle Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys(Springer, 2017-10-12) Dias, Marcelino; Costa, Thiago A.; Soares, Thiago; Silva, Bismarck Luiz; Cheung, Noé; Spinelli, José Eduardo; Garcia, AmauriArticle Sn-0.5Cu(-x)Al solder alloys: microstructure-related aspects and tensile properties responses(MDPI, 2019) Lima, Thiago Soares; Gouveia, Guilherme Lisboa de; Septimio, Rudimylla da Silva; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Spinelli, José Eduardo; Cheung, NoéArticle Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples(Springer, 2020) Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé