Centro de Tecnologia
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Article Advancing the solidification of Sn–Bi alloys for electronic packaging: challenges, progress, and future directions(MetalMat, 2025-08-18) Silva, Bismarck Luis; Xavier, Marcela Gautê Cavalcante; Spinelli, José Eduardo; https://orcid.org/0000-0001-7191-1942; https://orcid.org/0000-0003-0611-1038; https://orcid.org/0000-0001-5690-9377Article Assessment of the solidification behavior and microhardness of Sb-modified Sn-Ag alloys(Microelectronics Reliability, 2025) Freitas, Pâmella Raffaela Dantas de; Sobral, Bruno Silva; Sousa, Raí Batista de; Paixão, Jeverton Laureano; Carvalho, Zulmara Virginia de; Spinelli, José Eduardo; Silva, Bismarck Luiz; https://orcid.org/0009-0006-0276-2123; https://orcid.org/0000-0001-5722-5081; https://orcid.org/0000-0002-5233-6847; https://orcid.org/0000-0003-3482-2638; https://orcid.org/0000-0003-2923-652X; https://orcid.org/0000-0001-7191-1942Article A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys(Elsevier, 2018-02) Dias, Marcelino; Costa, Thiago Antônio; Silva, Bismarck Luiz; Spinelli, José Eduardo; Cheunga, Noé; Garcia, AmauriArticle Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate(Elsevier, 2019-11-15) Schon, Aline Ferreira; Reyes, Rodrigo Valenzuela; Spinelli, José Eduardo; Garcia, Amauri; Silva, Bismarck LuizArticle Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys(Elsevier, 2020-08) Paixão, Jeverton Laureano; Gomes, Leonardo Fernandes; Reyes, Rodrigo Valenzuela; Garcia, Amauri; Spinelli, José Eduardo; Silva, Bismarck LuizArticle Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys(Elsevier, 2016-04) Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José EduardoArticle Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys(Elsevier, 2017-01-15) Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José EduardoArticle Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys(Elsevier, 2017-09-29) Silva, Bismarck Luiz; Xavier, Marcella Gautê Cavalcante; Garcia, Amauri; Spinelli, José EduardoArticle Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: related effects on the matrix micromorphology, nature of intermetallics and tensile properties(Elsevier, 2017-11-05) Xavier, Marcella Gautê Cavalcante; Cruz, Clarissa Barros da; Kakitani, Rafael; Silva, Bismarck Luiz; Garcia, Amauri; Cheung, Noé; Spinelli, José EduardoArticle Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys(Springer, 2017-01-10) Silva, Bismarck Luiz; Silva, Vítor Covre Evangelista da; Garcia, Amauri; Spinelli, José Eduardo